PEASSS Bread Boarding

The bread boarding of the hardware includes nanosat electronics, power generation, piezo-actuated structure and FBG sensors and interrogator. In the bread boarding phase the individual components is functionally tested. Also some Thermal Vacuum testing on very temperature sensitive components has been performed successfully.

 

thermal vacuum test on interrogator, including the model for thermal simulation.

 

Vibration tests are not performed on component level. The different components are assembled and integrated into an EQM.  This EQM model is fully functional test on component level. The bread boarding is finished successfully with a full functional testing program.

 

PEASSS integrated EQM model. The side panels are removed.

PEASSS integrated EQM model. The side panels are removed.